Mems mass-spring-damper systems using an out-of-plane suspension scheme

ABSTRACT

MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) using an out-of-plane (or vertical) suspension scheme, wherein the suspensions are normal to the proof mass, are disclosed. Such out-of-plane suspension scheme helps such MEMS mass-spring-damper systems achieve inertial grade performance. Methods of fabricating out-of-plane suspensions in MEMS mass-spring-damper systems (including MEMS gyroscopes and accelerometers) are also disclosed.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority from U.S. provisional patentapplication No. 61/181,565 filed on May 27, 2009, the subject matter ofwhich is hereby incorporated by reference.

FIELD OF THE INVENTION

The present invention relates to microelectromechnical (MEMS)mass-spring-damper (MSD) systems generally. More specifically, thepresent invention relates to MEMS MSD systems, including MEMS gyroscopesand accelerometers, that are inertial grade and/or that use anout-of-plane (or vertical) suspension scheme and a method forfabricating such MEMS MSD systems.

BACKGROUND OF THE INVENTION

MEMS sensors, such as MEMS gyroscopes and accelerometers, are known inthe art. In the past few decades, such sensors have drawn greatinterest. MEMS technology is attractive because, among other reasons, itenables efficient packaging, minimizes sensor area, and significantlyreduces power consumption. Further, more specifically, MEMS sensors canbe easily integrated with driving and sensing electronics(CMOS-compatible), such that everything can be packaged on the samechip.

Prior art MEMS sensors typically operate in the rate grade. In otherwords, generally speaking, such MEMS sensors have a rate resolutiongreater than 0.1°/hr^(1/2), and require 100 μg for the resolution ofdetection. Rate grade sensors are useful in certain applications, suchas in airbag deployment systems, vehicle stabilization systems, andnavigation systems in the automotive industry. But in applications wheregreater sensor sensitivity is required, rate grade sensors may not besuitable. For example, in applications in the space industry (such asPicosatellites and planetary landers), inertial grade sensors should beused. Inertial grade sensors generally have a rate resolution less than0.001°/hr^(1/2), and may require fewer than 4 μg for the resolution ofdetection.

Prior art MEMS sensors may typically operate in the rate grade due tothe configuration of suspensions in the sensor. Typically, such MEMSsensor use in-plane (or horizontal) suspensions (which may beattributable, at least in part, to the fact that such configurationmakes it easier and more cost-effective to fabricate such MEMS sensors).The use of in-plane suspensions, however, makes it difficult to obtaininertial grade operation. This may be due to a number of reasons. Forexample, with such configuration, the suspensions and the proof mass aregeometrically coupled to one another. In other words, the dimensions ofthe suspensions cannot be modified without affecting the geometry of theproof mass. Such configuration also limits the proof mass area fillfactor of the sensor (or, in other words, the ratio between the areaoccupied by the proof mass and the total area of the sensor). This mayin turn limit the potential size of the proof mass. Reducing the size ofthe proof mass may result in, among other things, a degraded Browniannoise floor, an increase in the minimum detectable angular rate, and aworsening of output signal sensitivity to input angular rate, as well asa decease in signal-to-noise ratio (SNR). Further, in such arrangement,out-of-plane deflection may be suppressed, which may, in certaininstances, detrimentally affect performance.

The use of out-of-plane suspensions in MEMS sensors, however,significantly improves sensor performance, enabling MEMS sensors toachieve inertial grade operation. Such configuration may do so for anumber of reasons. For example, the configuration decouples thesuspensions from the proof mass, allowing the dimensions of thesuspensions to be optimized without affecting the space available forthe proof mass, and, further, significantly improves the proof mass areafill factor of the sensor, as well as the volume fill factor. Suchconfiguration permits a larger proof mass and reduces the resonancefrequency and Brownian noise floor, as well as improves the mechanicalquality factor, the output signal sensitivity to input angular rate, andSNR.

For the aforementioned reasons and others, there is a need in the artfor MEMS sensors (including MEMS gyroscopes and accelerometers) that areinertial grade and/or that use out-of-plane (or vertical) suspensions,as well a method for fabricating such MEMS sensors.

SUMMARY OF THE INVENTION

Novel MEMS MSD systems, which use out-of-plane suspensions, arepresented. In some embodiments, such MEMS MSD systems may be inertialgrade.

An embodiment of a MEMS gyroscope of the present invention is alsopresented, and may be comprised of a shared proof mass, one or moreanchors, one or more movable combs, and a plurality of suspensions,wherein said suspensions are out-of-plane with said shared proof mass.In some embodiments, such MEMS gyroscope may be inertial grade.

An embodiment of a MEMS accelerometer of the present invention is alsopresented, and may be comprised of a proof mass, one or more anchors,and a plurality of suspensions, wherein said suspensions areout-of-plane with said proof mass. In some embodiments, such MEMSaccelerometer may be inertial grade.

A manufacturing process for fabricating out-of-plane suspensions in MEMSMSD systems is also presented. In an embodiment of such fabricationprocess, the first two sides of an out-of-plane suspension may berealized by etching from a top surface of a substrate, and the other twosides of said out-of-plane suspension may be realized by etching from abottom surface of said substrate. Embodiments of fabrication processesfor embodiments of a MEMS gyroscope and a MEMS accelerometer of thepresent invention are also presented, as applications of theaforementioned manufacturing process for fabricating out-of-planesuspensions.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1a is an angled, top view of an embodiment of a MEMS gyroscope ofthe present invention.

FIG. 1b is an angled, top view of another embodiment of a MEMS gyroscopeof the present invention.

FIGS. 1c and 1d illustrate how driving and/or sensing electronics may beconnected to a MEMS gyroscope of the present invention.

FIG. 2a is an angled, top view of an embodiment of a MEMS accelerometerof the present invention.

FIG. 2b is a front view of an embodiment of a MEMS accelerometer of thepresent invention.

FIG. 2c is a front view of another embodiment of a MEMS accelerometer ofthe present invention.

FIG. 2d illustrates how driving and/or sensing electronics may beconnected to a MEMS accelerometer of the present invention.

FIG. 3a is an example of a potential quad-mass sensing scheme usingprior art dual-mass gyroscopes.

FIG. 3b illustrates how prior art dual-mass gyroscopes cannot be“stacked” next to one another in a quad-mass sensing scheme.

FIGS. 3c and 3d are two embodiments of a quad-mass sensing scheme of thepresent invention, in which a quad-mass gyroscope is linearly driven andlinearly sensed.

FIGS. 3e and 3f are two embodiments of a quad-mass sensing scheme of thepresent invention, in which a quad-mass gyroscope is linearly driven butnon-linearly sensed.

FIG. 3g illustrates the sensing directionality for the quad-mass sensingschemes in FIGS. 3c through 3 f.

FIGS. 4a through 4b illustrate steps that may be used to realizevertical suspensions in a MEMS MSD system.

FIGS. 5a through 5l illustrate cross-sections of various steps in anembodiment of the manufacturing process for an embodiment of a MEMSgyroscope of the present invention.

FIGS. 6a through 6l illustrate cross-sections of various steps in anembodiment of the manufacturing process for an embodiment of a MEMSaccelerometer of the present invention.

FIGS. 7a and 7b are scanning electronic microscope (SEM) images of anembodiment of a MEMS gyroscope of the present invention. FIG. 7c is aSEM image of an embodiment of a MEMS gyroscope of the present inventionthat illustrates the openings that may be used to short circuit certaincomponents in said gyroscope.

FIG. 8 is a SEM image of an embodiment of a MEMS accelerometer of thepresent invention.

DETAILED DESCRIPTION Gyroscope

FIG. 1a illustrates an embodiment of a MEMS gyroscope of the presentinvention. The gyroscope 10 may comprise, among other things, a sharedproof mass 20; first, second, third, and fourth anchors 30 a, 30 b, 30c, 30 d; first and second drive combs 40 a, 40 b; first and second sensecombs 50 a, 50 b; and a plurality of suspensions 60.

The shared proof mass 20 may be located at the center of said gyroscope10, and may have first, second, third, and fourth edges and first,second, third, and fourth corners. In some embodiments, the shared proofmass 20 may be square-shaped. The shared proof mass 20 (as well as theother components of the gyroscope 10) may be made of any dielectricsubstance. In some embodiments, the shared proof mass 20 may becomprised of crystalline Silicon (Si). Also in some embodiments, theremay be a layer of oxide dividing the shared proof mass 20 into an upperand a lower mass. During operation of the gyroscope 10, the shared proofmass 20 may vibrate. Where there is a rotation of the gyroscope 10, theshared proof mass 20 may experience a “secondary vibration,” or vibratein an orthogonal direction. Such secondary vibrations may be used todetermine the angular velocity (and thus angular displacement) of theobject or device to which the gyroscope 10 is affixed or connected.

Each anchor 30 a-d of the gyroscope 10 may lie parallel with an edge ofsaid shared proof mass 20, such that, for example, the first anchor 30 alies parallel with the first edge of the shared proof mass 20. Eachanchor 30 a-d may have a first corner and a second corner. In someembodiments, the anchors 30 a-d may have the same range of length andthickness as the shared proof mass 20, and further may each have a widthranging from 200 μm to 400 μm. Varying the dimensions of said anchorsshould generally not affect the performance of the gyroscope 10. In someembodiments, the anchors 30 a-d may be made of crystalline Si. Theanchors 30 a-d may be used to fix, or “anchor,” the gyroscope 10 and/orthe components thereof to the substrate on which the gyroscope 10 rests.

Suspensions 60 may extend out-of-plane, or vertically or upward, fromthe first and second corners of the anchors 30 a-b. Suspensions 60 maysimilarly extend out-of-plane from the first, second, third, and fourthcorners of the shared proof mass 20. Thus, in some embodiments, saidshared proof mass 20 may rest below the suspensions 60, and, in certainof such embodiments, in plane with the anchors 30 a-b. Also in someembodiments, said suspensions 60 may have a cross-section ranging from5×5 μm² to 100×100 μm², and, in certain of such embodiments, have across-section of 10×70 μm². Also in some embodiments, said suspensions60 may have a length ranging from 150 μm to 600 μm, and, in certain ofsuch embodiments, have a length of 250 μm. The cross-sectionaldimensions and the length of the suspensions 60 may affect the stiffnessconstant of said suspensions 60, which may affect such sensor's resonantfrequency, support losses, quality factor, and/or noise level, as wellas rotation rate. Generally speaking, increasing the size of asuspension's 60 cross-section increases its stiffness, and increasing asuspension's 60 length decreases its stiffness. The cross-section andlength of the suspensions 60 should be designed so as to minimizesuspension 60 stiffness. In some embodiments, the suspensions 60 may bemade of crystalline Si.

Said suspensions 60 may provide support for the movable combs. In someembodiments, said movable combs may be comprised of first and seconddrive combs 40 a-b and first and second sense combs 50 a-b. The firstand second drive combs 40 a-b may have first, second, third, and fourthcorners. Similarly, the first and second sense combs 50 a-b may havefirst, second, third, and fourth corners. Said suspensions 60, extendingfrom said anchors 30 a-d and said shared proof mass 20, may connect withsaid corners of said combs 40 a-b, 50 a-b, with said combs 40 a-b, 50a-b resting on top of said suspensions 60.

In some embodiments, the drive combs 40 a-b and sense combs 50 a-b mayhave the same dimensions as one another, and the gyroscope 10 may be athree-fold-symmetric gyroscope (3FSG). In other words, the gyroscope 10may have three geometrical symmetries: about the center line, parallelto the X-axis; about the center line, parallel to the Y-axis; and aboutthe diagonal of the gyroscope 10. Such symmetry aids in matching thedriving and sense modes of said gyroscope 10. The drive combs 40 a-b maybe used for the actuation of the spring-mass-damper system (for example,in the X-direction). When a rotational rate is applied (for example, inthe Z-direction), the sense combs 50 a-b may be used to sense theCoriolis force in the cross-product direction (for example, in theY-direction). In some embodiments, the combs 40 a-b, 50 a-b may be madeof crystalline Si.

The total proof mass of the gyroscope 10 may be the shared proof mass 20plus two combs 40 a-b, 50 a-b. In some embodiments, the total driveproof mass may be the shared proof mass 20 plus the first and seconddrive combs 40 a-b, and, similarly, the total sense proof mass may bethe shared proof mass 20 plus the first and second sense combs 50 a-b.The total proof mass may have a length and width ranging from 100 μm to3 mm and a thickness ranging from 10 μm to 300 μm. In certainembodiments, the total proof mass may be 1200 μm×1200 μm×200 μm, andhave a proof mass area fill factor of 73.4%. Also in some embodiments,the total proof mass may have a weight ranging from 30 μg to 3 mg. Incertain embodiments, the two combs 40 a-b, 50 a-b may comprise less than10% of the area and weight of the total proof mass.

FIG. 1b illustrates another embodiment of a MEMS gyroscope 10′ of thepresent invention, specifically a gimbaled MEMS gyroscope 10′. In thisembodiment, four anchors 30 a′-30 d′ are used to fix, or “anchor,” saidgyroscope 10′ to the substrate on which the gyroscope 10′ rests. Outersuspensions 60 a′ may then extend out-of-plane (or upwardly therefrom)to support an outer proof mass (or gimbal) 20 a′. Inner suspensions 60b′ may then extend out-of-plane from said outer proof mass 20 a′.Resting on top of said inner suspensions 60 b′ may be an inner proofmass 20 b′. As can be seen in FIG. 1b , in this embodiment, the proofmasses 20 a′-b′ may rest on top of, instead of being suspended below (asin FIG. 1a ), their respective suspensions 60 a′-b′. In this embodiment,the outer proof mass 20 a′ may vibrate in the drive mode (X-axis), whilethe inner proof mass 20 b′ may vibrate in the sense mode (Y-axis). Suchconfiguration may decouple sensed motion in two orthogonal directions.

Accelerometer

FIG. 2a illustrates an embodiment of a MEMS accelerometer of the presentinvention. The accelerometer 110 may comprise, among other things, aproof mass 120; first, second, third, and fourth anchors 130 a, 130 b,130 c, 130 d; and a plurality of suspensions 160.

The proof mass 120 may be located at the center of said accelerometer110, and may have first, second, third, and fourth corners. In someembodiments, there may be a layer of oxide dividing the proof mass 120into an upper mass 122 a and a lower mass 122 b. Also in someembodiments, the upper mass 122 a and lower mass 122 b may have a lengthand width ranging from 100 μm to 3 mm, as well as a thickness rangingfrom 10 μm to 300 μm. Also in some embodiments, the proof mass 120 mayhave a weight ranging from 30 μg to 3 mg. As with the gyroscope,increasing the weight of the proof mass 120 may improve the sensitivityof the accelerometer 110, while increasing the dimensions of the proofmass 120 may detrimentally affect performance. The proof mass 120 (aswell as the other components of the accelerometer 110) may be made ofany dielectric substance. In some embodiments, the proof mass 120 may bemade of crystalline Si. Where the object or device to which theaccelerometer 110 is affixed or connected to moves, the proof mass 120will vibrate or be displaced. Such vibration or displacement may be usedto determine the angular acceleration of such object or device.

Each anchor 130 a-d of the accelerometer 110 may lie at or around acorner of the proof mass 120, such that, for example, the first anchor130 a lies at or around the first corner of the proof mass 120. Eachanchor 130 a-d may have a first corner. Varying the dimensions of saidanchors 130 a-d should generally not affect the performance of theaccelerometer 110. In some embodiments, the anchors 130 a-d may be madeof crystalline Si. The anchors 130 a-d may be used to fix, or “anchor,”the accelerometer 110 and/or the components thereof to the substrate onwhich the accelerometer 110 rests.

Suspensions 160 may extend out-of-plane, or vertically or upward, fromthe first corners of the anchors 130 a-d, and may connect with thefirst, second, third, and fourth corners of the proof mass 120. Thus, insome embodiments, the proof mass 120 may rest on top of said suspensions160. Such configuration is consistent with the function of anaccelerometer, which need only sense in a single mode. In someembodiments, said suspensions 160 may have a cross-section ranging from5×5 μm² to 100×100 μm². Also in some embodiments, said suspensions 160may have a length ranging from 250 μm in to 600 μm. The cross-sectionaldimensions and length of the suspensions 160 may affect the stiffnessconstant of said suspensions 160, as such dimensions and lengthsimilarly affect the gyroscope 10 (as described above), and, morespecifically, may affect the resolution in acceleration. In someembodiments, the suspensions 160 may be made of crystalline Si.

FIGS. 2b and 2c illustrate front views of two embodiments of a MEMSaccelerometer of the present invention. FIG. 2b , like FIG. 2a ,illustrates an embodiment where the proof mass 120 rests on thesuspensions 160. FIG. 2c illustrates another embodiment, where thesuspensions 160 are connected directly to the upper mass 122 a, andwhere the lower mass 122 b is smaller than, and thus “hangs” below, saidupper mass 122 a. In some embodiments, said lower mass 122 b may be 100μm to 200 μm shorter in length than said upper mass 122 a. Suchconfiguration may be achieved during the selective etching in thefabrication process described below. As can be seen by a comparison ofFIGS. 2b and 2c , the configuration in FIG. 2c allows for an increasedsuspension 160 length. FIG. 2c further demonstrates the geometricaldecoupling of the suspensions 160 and the proof mass 120, a benefit ofthe present invention.

Quad-Mass MEMS Gyroscopes and Other Sensors

The use of out-of-plane (or vertical) suspensions provides a furtherbenefit with respect to multi-mass sensors. By way of example,multi-mass gyroscopes may be implemented by situating two prior artdual-mass gyroscopes 210 a, 210 b next to each other, facing in oppositedirections, as can be seen in FIG. 3a . (The anchors are labeled as 212,and the in-plane suspensions are labeled as 214.) There are numerousdrawbacks to such arrangement. For example, this arrangement doubles theoverall area that the sensors (or gyroscopes) occupy. Further, suchprior art dual-mass gyroscopes 210 a-b must be wired to one another toshare sensory information. Such drawbacks cannot be alleviated usingsuch prior art dual-mass gyroscopes because, as can be seen from FIG. 3b, such gyroscopes 210 a-b cannot be “stacked” next to one another due tothe presence of the in-plane (or horizontal) suspensions 214, whichwould interfere with each other.

As can be from FIGS. 3c through 3f , by contrast, the use ofout-of-plane suspensions permits four sensors (including, withoutlimitation, MEMS gyroscopes and accelerometers) of the present inventionto be placed one next to the other. By way of example, in a quad-massgyroscope of the present invention, four gyroscopes 220 a, 220 b, 220 c,220 d of the present invention may be placed one next to the other tocreate a dual-differential sensing scheme. The gyroscopes 220 a-d mayshare sense combs and/or drive combs (and thus electrical sense and/ordrive signal circuitry). With respect to FIGS. 3c and 3d , suchquad-mass gyroscopes 220 are linearly driven and linearly sensed. Withrespect to FIGS. 3e and 3f , such quad-mass gyroscopes 220 are linearlydriven but non-linearly sensed. Locations of where first (driving),third (sensing), and, where applicable, fourth (sensing) signals may befound are labeled on 250 a, 250 c, and 250 d. (A second (driving) signalis not shown, but may be connected to the gyroscopes 220 a-d to providea DC polarization voltage, as well other driving signals.) As can beseen by comparing FIGS. 3c and 3d to FIGS. 3e and 3f , the embodimentsin FIGS. 3e and 3f use parallel plate capacitors with respect to thesense combs, whereas the embodiments in FIGS. 3c and 3d use comb-drivecapacitors. Parallel plate capacitors may provide more sensingcapacitance and capacitance changes due to displacement.

As should be obvious to one skilled in the art, the out-of-plane (orvertical) suspension scheme presented herein is not limited to use inrespect of gyroscopes, accelerometers, and quad-mass gyroscopes, butrather can be used in other MEMS sensory systems. Specifically, suchout-of-plane suspension scheme can be used in any MEMS MSD system(including, by way of example and without limitation, radio frequencyMEMS resonators and MEMS-based mechanical filters), as MSD systems use amass attached to a suspension to detect and/or determine sensoryinformation.

Method of Fabrication

The MEMS MSD systems of the present invention, including MEMS gyroscopesand accelerometers, can be fabricated using various types ofmicromachining. By way of example, various type of bulk micromachiningmay be used, including, without limitation, deep reactive ion etching(DRIE), LIGA, and electroforming. Bulk micromachining provides a numberof advantages over surface micromachining. For example, bulkmicromachining allows for a sensor with a larger proof mass and improvedcapacitance. Also by way of example, with surface micromachining, thelateral (in-wafer-plane) dimensions are generally tighter than thoseallowed by bulk micromachining techniques, in part due to the inherentmechanical stresses and stress gradient of surface micromachinedstructural layers.

As previously described, the MEMS MSD systems of the present inventionuse out-of-plane suspensions. The following steps represent anembodiment of the manufacturing process that may be used to fabricatesuch out-of-plane suspensions in such MEMS MSD systems. First, adielectric substrate 500 may be etched from the top surface 502 to formthe first two sides of an out-of-plane suspension 506 a-b, as can beseen in FIG. 4a . In some embodiments, said first two sides of saidout-of-plane suspension 506 a-b may be patterned using DRIE. Second,said dielectric substrate 500 may be etched from the bottom surface 504to form the other two sides of said out-of-plane suspension 506 c-d, ascan be seen in FIG. 4b . In some embodiments, said other two sides ofsaid out-of-plane suspension 506 c-d may also be patterned using DRIE.The cross-section and length of said suspension may be dictated by thedesired performance characteristics of the applicable MEMS MSD system.

Methods of fabricating an embodiment of a MEMS gyroscope of the presentinvention and an embodiment of a MEMS accelerometer of the presentinvention will now be presented, as applications of the fabricationprocess described in the preceding paragraph. Although the followingmethods are presented in a specific sequence, other sequences may beused and certain steps omitted or added. It should be noted that theshapes of any etchings, and the dimensions of such shapes, as well asthe shapes and depths of any deposited metal, will be dictated by thedesired dimensions and shapes of the sensor and the components thereof,as will be obvious to one having ordinary skill in the art.

MEMS Gyroscope

As shown in FIG. 5a , a substrate 510, such as silicon on insulator(SOI) substrate, having a top surface 512 and a bottom surface 514 maybe provided. In some embodiments, said substrate 510 may, starting fromthe top surface 512, have the following layers: a first layer of oxide520 having a thickness of 4 μm; a first layer of silicon 522 having athickness of 100 μm; a second layer of oxide 524 having a thickness of 4μm; a second layer of silicon 526 having a thickness of 570 μm; and athird layer of oxide 528 having a thickness of 4 μm. Said oxide layers520, 524, 528 may each act as a sacrificial layer during etching.

As shown in FIGS. 5b and 5c , the top surface 512 of the substrate 510may be selectively etched to define the shared proof mass, the movablecombs, and the out-of-plane suspensions, as well the openings 530 thatmay be used to short circuit portions of certain gyroscope componentsthat are separated by the second layer of oxide 524. Generally speaking,said openings 530 should be narrow enough to allow for a conformalcoating of a conductive metal and to permit a trench that may be etchedtherethrough to close completely when said metal is deposited. Bydepositing a conductive material in the trenches that may be etched insaid openings 530, said portions of said certain gyroscope componentsmay be “short circuited” and thus electrically connected to one another.Contact pads for the shared proof mass may also be etched in thesesteps. Signals sensed by the shared proof mass through the out-of-planesuspensions and down to the sensor's anchors may be transmitted to suchcontact pads. In some embodiments, the etching may be to a depth of 130μm to 140 μm, thereby etching through said first layer of oxide 520,said first layer of silicon 522, said second layer of oxide 524, and aportion of said second layer of silicon 526.

As shown in FIG. 5d , the top surface 512 of the substrate 510 may befurther etched to remove the remainder of the first oxide layer 520.This will prepare the substrate 510 for the deposition of the conductivemetal as described in the next paragraph.

As shown in FIG. 5e , in this step, a conductive metal may be depositedby various techniques (including, without limitation, sputtering,platting, and pulse laser deposition) on the top surface 512 of thesubstrate 510. In some embodiments, a conformal coating of SiliconGermanium (SiGe) may be deposited, using low pressure chemical vapordeposition (LPCVD), on said top surface 512 and in the areas etched inthe preceding two steps (e.g., the openings 530). Such conductive metalmay short-circuit the total proof mass. In this case, short circuitingthe total proof mass may be done through the movable combs, which, inthis embodiment, are the parts that are connected to the suspensionsaffixed to the anchors. Such short-circuit may be necessary so that thesignal from the movable combs may be passed through the anchors by wayof the out-of-plane suspensions.

As shown in FIG. 5f , a thin layer of oxide may be selectively depositedon the top surface 512 of the substrate 510, over the conductive metaldeposited in the previous step. In some embodiments, Silicon Dioxide(SiO₂) may be selectively deposited using LPCVD. This may be used todefine, among other things, the fixed electrodes. The fixed electrodesare fixed comb-drive electrodes that may face the movable comb-driveelectrodes of the drive and sense modes. Said fixed electrodes representthe other terminal of the linear comb-drive capacitance (whether for thedrive and sense modes of the gyroscope or for the sense mode of theaccelerometer). They may be used to interface the fabricated gyroscopeto the drive and sense circuitry (i.e., the CMOS). In some embodiments,the thickness of the oxide may range sub-μm to 10 μm, depending thepermissible parasitic capacitance.

As shown in FIG. 5g , the areas between said fixed electrodes 550 andthe gyroscope may be selectively etched. In some embodiments, said areasmay be etched using DRIE through to the second layer of oxide 524.

As shown in FIG. 5h , the layer of oxide remaining on the top surface512 of the substrate 510 may then be etched, in some embodiments usingDRIE, so as to remove the remainder of such oxide. Such etching maycomplete the fabrication of the top surface 512 of the substrate 510,realizing the fixed electrodes 550, the shared proof mass 20, and thedrive and sense combs 40 a-b, 50 a-b. (As can be seen in this FIG. 5h ,there is a “short circuit” in the middle of the movable combs,connecting the portions of said combs that are below and above thesecond layer of oxide 524.)

As shown in FIGS. 5i and 5j , the bottom surface 514 of the substrate510 may be selectively etched, in some embodiments using DRIE, to definethe outer boundaries 532 of the gyroscope. Such etching may be to adepth of 50 μm.

As shown in FIG. 5k , the bottom surface 514 of the substrate 510 may befurther selectively etched to remove selected portions of the thirdlayer of oxide, in order to prepare the bottom surface 514 of thesubstrate 510 for further etching.

As shown in FIG. 5l , the bottom surface 514 of the substrate 510 may beselectively etched to finalize the gyroscope. At the outer boundaries,said bottom surface 514 may be etched up to the second layer of oxide524. The bottom surface may be etched to a depth of 250 μm to 500 μm torealize the out-of-plane suspensions 60. In some embodiments, DRIE maybe used to perform such etching. Such etching may, among other things,reduce parasitic capacitance.

MEMS Accelerometer

As shown in FIG. 6a , a substrate 610, such as silicon on insulator(SOI) substrate, having a top surface 612 and a bottom surface 614 maybe provided. In some embodiments, said substrate 610 may, starting fromthe top surface 612, have the following layers: a first layer of oxide620 having a thickness of 4 μm; a first layer of silicon 622 having athickness of 100 μm; a second layer of oxide 624 having a thickness of 4μm; a second layer of silicon 626 having a thickness of 570 μm; and athird layer of oxide 628 having a thickness of 4 μm. Said oxide layers620, 624, 628 may each act as a sacrificial layer during etching.

As shown in FIG. 6b , the first layer of oxide 620 may be selectivelyetched to define the openings 630 for the trenches that will be used to“short circuit” the proof mass, as well as to define the out-of-planesuspensions. Further, as shown in FIG. 6c , the openings 630 andout-of-plane suspensions may be etched through to a depth of 130 μm to140 μm. In some embodiments, said etching may be performed using DRIE.

As shown in FIG. 6d , the top surface 612 of the substrate 610 may befurther etched to remove the remainder of the first oxide layer 620. Insome embodiments, said etching may be performed using DRIE. This willprepare the substrate 610 for the deposition of the conductive metal asdescribed in the next paragraph.

As shown in FIG. 6e , in this step, a conductive metal may be depositedby various techniques (including, without limitation, sputtering,planing, and pulse laser deposition) on the top surface 612 of thesubstrate 610. In some embodiments, a conformal coating of SiliconGermanium (SiGe) may be deposited, using low pressure chemical vapordeposition (LPCVD), on said top surface 612 and in the openings 630 andout-of-plane suspensions. As with the gyroscope, the conductive metaldeposited in the openings may short-circuit parts of the proof mass(i.e., parts below and above the second oxide layer).

As shown in FIG. 6f , a thin layer of oxide may be selectively depositedon the top surface 612 of the substrate 610. In some embodiments,Silicon Dioxide (SiO₂) may be selectively deposited using LPCVD. Thismay be used to define, among other things, the isolated electrodes. Theisolated electrodes carry the necessary electrical signals for sensingpurposes. In some embodiments, the thickness of the oxide may range fromsub-μm to 10 μm, depending on the maximum permissible parasiticcapacitance.

As shown in FIG. 6g , the areas between the isolated electrodes 650 andthe accelerometer may be selectively etched. In some embodiments, saidareas may be etched using DRIE through to the second layer of oxide 624.

As shown in FIG. 6h , the layer of oxide remaining on the top surface612 of the substrate 610 may then be etched, in some embodiments usingDRIE, so as to remove the remainder of such oxide. Such etching maycomplete the fabrication of the top surface 612 of the substrate 610,realizing the isolated electrodes 650 and the proof mass 120.

As shown in FIGS. 6i and 6j , the bottom surface 614 of the substrate610 may be selectively etched, in some embodiments using DRIE, to definethe outer boundaries 632 of the accelerometer. Such etching may be to adepth of 50 μm.

As shown in FIG. 6k , the bottom surface 614 of the substrate 610 may befurther selectively etched to remove selected portions of the thirdlayer of oxide 628, in order to prepare the bottom surface 614 of thesubstrate 610 for further etching.

As shown in FIG. 6l , the bottom surface 614 of the substrate 610 may beselectively etched to finalize the accelerometer. At the outerboundaries, said bottom surface 614 may be etched up to the second layerof oxide 624. Around the out-of-plane suspensions, the bottom surface614 may be etched to a depth of 250 μm to 550 μm to realize saidsuspensions 160. In some embodiments, DRIE may be used to perform suchetching. Such etching may, among other things, reduce parasiticcapacitance.

Test Results MEMS Gyroscope

An embodiment of a MEMS gyroscope of the present invention was testedagainst a prior art MEMS gyroscope, as such prior art gyroscope isdescribed in the following publication: A. Shaun, F. Zaman, B. Amini, F.Ayazi, “A High-Q In-Plane SOI Tuning Fork Gyroscope,” IEEE, 2004, pp.467-470. Such gyroscopes had the same sensor area, 2 mm², and waferthickness, 675 μm. The key difference between such gyroscopes was thatthe prior art MEMS gyroscope used in-plane suspensions, whereas the MEMSgyroscope of the present invention used out-of-plane suspensions. Withrespect to the MEMS gyroscope of the present invention, such tests wereperformed using COMSOL Multiphysics v3.5. The performance results of theprior art gyroscope were obtained from the aforementioned publication. Acomparison of the performance of each gyroscope can be seen in thefollowing Table 1.

TABLE 1 Prior Art Embodiment of the Performance Measure Design PresentInvention 1. Dimensions of the 570*570* 1200*1200*200 Total Proof Mass40 μm³ μm³ and Proof Mass PMAFF~17% PMAFF~73.4% Area Fill FactorPMVFF~1% PMVFF~22% (PMAFF) and (The effective mass is around Proof Mass22 times larger due to area and Volume Fill thickness expansion inherentFactor (PMVFF) with the novel gyroscope architecture.) 2. Total ProofMass 0.03 mg 0.67 mg (M_(e)) (The resulting mass is in the order of 1mg.) 3. Resonance 17.4 KHz 3.7 KHz Frequency (F_(r)) for (The frequencyis still high in the Same Stiffness this embodiment because of andSupport the Poly-Silicon material Losses properties.) 4. Quality Factors81,000 and 380,000 and 300,000 for Drive and 64,000 (These will belimited or Sense Modes clipped by the Q values due (Q_(d) and Q_(s)) tofinite support losses and thermo-elastic damping.) 5. Theoretical0.3°/hr 0.014°/hr Mechanical (The noise floor is reduced by NoiseEquivalent a factor of 22, and is deeply in Angular Rate the inertialgrade range.) (MNEΩ) 6. Drive Mode 1 μm 4.69 μm Amplitude (X_(d)) forthe Same Drive Voltage 7. Sense Mode 1 nm 103 nm Amplitude (X_(s)) (TheCoriolis displacement sensed at the output is more than two orders ofmagnitude more.) 8. Drive and Sense 0.16 pF 0.34 pF Capacitances (C_(d)(The capacitance is increased and C_(s)) due to improving the PMAFF, butthe active or electrical thickness is the same.) 9. Parasitic or 100*570μm² 100*100 μm² Coupling (The parasitic capacitance is Sustaining Areareduced by a factor of 5.7 as a for the Same SOI result of the suggestedsupport Oxide Thickness for the fixed combs.) 10. Electrical Output 1.25mV/°/s 125 mV/°/s Sensitivity (S_(e)) 11. Signal to Noise 4.17 mV/°/hr9.166 mV/°/hr Ratio (SNR) (The SNR is improved by 2200 times or morethan three orders of magnitude,)

As can be seen in Table 1, with the MEMS gyroscope of the presentinvention, the total proof mass size is increased by more than an orderof magnitude (i.e., ten times) in the same overall device area (i.e., 2mm²). The quality factor, drive amplitude, and resonance frequency areimproved by a factor of 4.7. The dominating Brownian noise floor islowered by a factor of 22, i.e., more than an order of magnitude.Furthermore, the sensed Coriolis displacement, output signal, and sensorsensitivity are improved by a factor of 103. Finally, the SNR isimproved by more than three orders of magnitude.

Table 2 shows the resonance frequency and coupling percentage forvarious embodiments of a MEMS gyroscope of the present invention. Suchsimulation results were obtained using COMSOL Multiphysics v3.5. As canbe seen from this table, the decoupling ratio of such variousembodiments of a MEMS gyroscope of the present invention are in the samerange as prior art MEMS gyroscopes (i.e., MEMS gyroscopes using in-planesuspensions). Thus, the MEMS gyroscopes of the present invention canprovide improved performance (as shown in Table 1) without detrimentallyaffecting other performance measures.

TABLE 2 Shared Proof Mass 800 μm 1000 1000 1000 1800 Side Length μm μmμm μm Shared Proof Mass 100 μm 100 μm 100 μm 100 μm 100 μm ThicknessWidth of the 100 μm 100 μm 100 μm 100 μm 100 μm Flying Comb PortionSuspension Cross- 10*70 10*70 10*50 10*50 10*70 Section μm² μm² μm² μm²μm² Dimensions Suspension Length 300 μm 400 μm 400 μm 300 μm 400 μmResonance 20.1 7.8 8.4 KHz 11.9 KHz 4.9 KHz Frequency KHz KHz Coupling2.3% 2.0% 1.7% 1.6% 1.4% Percentage

MEMS Accelerometer

Embodiments of a MEMS accelerometer of the present invention were testedagainst a prior art MEMS accelerometer, as such prior art accelerometeris described in the following publication: B. V. Amini and F. Ayazi,“Micro-Gravity Capacitive Silicon-On-Insulator Accelerometers,” Journalof Micromechanics, Vol. 15, No. 11, October 2005, pp. 2113-2120. The keydifference between the accelerometers was that the prior art MEMSaccelerometer used in-plane suspensions, whereas the MEMS accelerometersof the present invention obviously used out-of-plane suspensions. Withrespect to the MEMS accelerometers of the present invention, such testswere performed using COMSOL Multiphysics v3.5. The performance of theresults of the prior art gyroscope were obtained from the aforementionedpublication. A comparison of the performance of each accelerometer canbe seen in the following Table 3.

TABLE 3 Embodiment of the Embodiment of the Prior Art Present InventionPresent Invention Performance Measure Design With Reduced Area With SameArea Area of the Proof Mass 12 1.65 12 (mm²) Proof Mass 1.7 0.98 7.1(mg) Resonance Frequency 2000 670 250 (Hz) Brownian Noise Floor 0.70.842 0.19 (μg Hz^(−1/2)) Static Sensitivity >0.2 >0.07 >0.98 (pF g⁻¹)

As can be seen from Table 3, the MEMS accelerometer of the presentinvention can provide the same or similar performance as the prior artdesign, but with less than 15% of the proof mass area. The resultingresonance frequency is 66% less. Moreover, with the present invention,the Brownian noise floor will remain sub-μg. Furthermore, when the MEMSaccelerometer of the present invention is designed to use the samedevice area as the prior art design, performance is significantlyimproved. First, the proof mass becomes rather large (approximately 7mg). Further, the resonance frequency is decreased to 250 Hz, which isless than 13% of the resonance frequency of the prior art design. Inaddition, the Brownian noise floor is deeply in the inertial graderange. Finally, with the present invention, the SNR is improved by morethan an order of magnitude.

Table 4 shows the resonance frequency and coupling percentage forvarious embodiments of a MEMS accelerometer of the present invention.Such simulation results were obtained using COMSOL Multiphysics v3.5.This table shows the range of resonant frequencies that be achievedusing the present invention with a small proof mass.

TABLE 4 Upper Mass 1500*1500* 1500*1500* 1500*1500* 1500*1500*Dimensions (μm) 100 100 100 100 Lower Mass 1500*1500* 1500*1500*1500*1500* 1440*1440* Dimensions (μm) 100 100 100 100 Suspension Cross-10*30 10*30 10*30 10*30 section Dimensions (μm) Suspension 250 300 350450 Length (μm) Resonance 5389 4121 3288 2316 Frequency (Hz)

1. A MEMS gyroscope, comprising: a. a shared proof mass; b. one or moreanchors; c. one or more movable combs; and d. a plurality ofsuspensions; e. wherein said plurality of suspensions are out-of-planewith said shared proof mass.
 2. The MEMS gyroscope of claim 1, whereinsaid MEMS gyroscope is an inertial grade MEMS gyroscope.
 3. The MEMSgyroscope of claim 1, wherein said shared proof mass, together with saidone or more movable combs, have a combined weight ranging from 30 μg to3 mg.
 4. The MEMS gyroscope of claim 1, wherein said shared proof massis positioned below said suspensions.
 5. The MEMS gyroscope of claim 1,wherein said suspensions have a cross-section ranging from 5×5 μm² to100×100 μm².
 6. The MEMS gyroscope of claim 1, wherein said suspensionshave a length ranging from 150 μm to 600 μm.
 7. The MEMS gyroscope ofclaim 1, wherein said one or more movable combs rest on saidsuspensions.
 8. The MEMS gyroscope of claim 1, wherein said one or moremovable combs are comprised of first and second sense combs and firstand second drive combs.
 9. The MEMS gyroscope of claim 1, wherein saidMEMS gyroscope is a three-fold symmetric gyroscope.
 10. The MEMSgyroscope of claim 1, wherein said shared proof mass, said one or moreanchors, said one or more movable combs, and said suspensions arecomprised of crystalline Silicon.
 11. The MEMS gyroscope of claim 1,wherein said MEMS gyroscope is bulk micromachined. 12-23. (canceled) 24.A quad-mass MEMS gyroscope, comprising: a. a plurality of proof masses;b. one or more anchors; c. one or more movable combs; and d. a pluralityof suspensions; e. wherein said suspensions are out-of-plane with saidproof masses.
 25. The quad-mass MEMS gyroscope of claim 24, wherein saidone or more movable combs are comprised of a plurality of sense combsand a plurality of drive combs.
 26. The quad-mass MEMS gyroscope ofclaim 25, wherein each proof mass has its own respective drive comb, butsaid sense combs are shared by said proof masses.
 27. A MEMSmass-spring-damper system, comprising: a. at least one proof mass; andb. a plurality of suspensions; c. wherein said suspensions areout-of-plane with said at least one proof mass.
 28. The MEMSmass-spring-damper system of claim 27, wherein said MEMSmass-spring-damper system is an inertial grade range MEMSmass-spring-damper system.
 29. The MEMS mass-spring-damper system ofclaim 27, wherein said MEMS mass-spring-damper system is bulkmicromachined.
 30. A method for fabricating a vertical suspension in asubstrate in a MEMS mass-spring-damper system, said method comprisingthe steps of: a. realizing a first side and a second side of saidvertical suspension by selectively etching through a top surface of saidsubstrate; and b. realizing a third side and a fourth side of saidvertical suspension by selectively etching through a bottom surface ofsaid substrate.
 31. The method of claim 30, wherein said etching insteps (a) and (b) is performed using DRIE.
 32. The method of claim 30,wherein said MEMS mass-spring-damper system is an inertial grade MEMSgyroscope.
 33. The method of claim 30, wherein said MEMS mass-springdamper system is an inertial grade MEMS accelerometer.